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首页
About
Corporate
Corporate silhouette
Honor
Product display
3D ceramic packaging substrate
Ceramic circuit board
Lidar Integrated Edition
Sensor module packaging substrate
Flat LED ceramic bracket
High power packaging carrier board
Thick Film Integrated Circuit
Product Introduction
Introduction to Ceramic Technology
Introduction to Ceramic Materi
Process processing and flow
FEOL
BEOL
Product application scope
News
公司资讯
行业动态
常见问题
Contact
[English]
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LED照明领域的陶瓷PCB：技术升级后的更好基板材料
近年来LED照明领域的竞争，已从低端市场逐渐延伸到了中高端产品中，并有白热化趋势。在这片不见血的江湖里拼杀的同时，靠着政策补贴发家的厂商们不得不思考起这样一个问题：如果政策变化，或者LED市场开始饱和，那么···
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